Cooler Master Displays Vapor Chamber-based CPU Fan-Heatsink

There's little innovation with tower-type CPU coolers these days, barring the odd fancy aluminum fin design or heat-pipe layout. Cooler Master put its engineering muscle to use by developing a new tower-type CPU cooler that takes advantage of vapor-chamber technology. Called the TPC 812, the cooler is just large another aluminum fin tower-type heatsink with six heat pipes feeding head through the fin-stack, till the part where a specially-designed vapor-chamber element finds place.

The cooler uses a copper indirect contact base, at which the six heat pipes converge at the lowest level. Above it, is a vapor-chamber plate. From this place, two thin, broad columns arise, passing through the central portion of the aluminum fin stack. The heatsink is ventilated by a 120 mm fan. With its design innovation, the TPC 812 can handle thermal loads of up to 240W. The TPC 812 from Cooler Master will be priced around the $100 mark, and will be competitive with entry-level closed-loop liquid coolers.

Source: VR-Zone