Samsung Debuts the Series 9 3D All-in-One PC

Samsung Electronics has today officially launched (in South Korea) its Series 9 premium all-in-one desktop, a sleek and sexy machine with an asymmetrical design which makes use of a 27-inch Full HD (1920 x 1080) 3D panel.

Samsung's PC runs Windows 7 and also features an Intel Core i7 processor, up to 8 GB of RAM, an AMD Radeon mobile GPU, and a TV tuner. The Series 9 AiO comes bundled with a pair of 3D glasses, wireless mouse and keyboard. No word on pricing though.

Source

Samsung Announces New 27-inch 3D LED Monitor for Gaming

Samsung launched a new PC monitor targeting 3D gaming (as in gaming with stereo 3D). The SyncMaster S27A750D is a 27-inch LED-backlit LCD monitor that is geared for stereo 3D, thanks to support for 120 Hz refresh rate. The display boasts a native resolution of 1920 x 1080 pixels, with 2 ms (GTG) response time. Other panel specifications include 10,000,000:1 Mega Dynamic Contrast Ratio, 1,000:1 static contrast ratio, and 300 cd/m² brightness.

The SyncMaster S27A750D is equipped with ambient light sensors to adjust brightness accordingly, and a motion sensor that detects if the user is away, so it can dim down the panel and save power in the process. Display inputs include HDMI and DisplayPort. A pair of 3D shutter glasses come bundled. The SyncMaster S27A750D is priced at €518, on pre-order.

Source: TechConnect Magazine

Samsung Develops 30nm-class 32GB Green DDR3 for Next-generation Servers

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung’s advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

“These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics. “We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems,” he added.

The new 32GB RDIMM with 3D TSV package technology is based on Samsung's 30nm-class four gigabit (Gb) DDR3. It can transmit at speeds of up to 1,333 megabits per second (Mbps), a 70 percent gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps.

Further, the 32GB-module consumes a mere 4.5 watts per hour – the lowest power consumption level among memory modules adopted for use in enterprise servers. Compared to the 30nm-class 32GB load-reduced, dual-inline memory module (LRDIMM), which offers advantages in constructing 32GB or higher memory solutions, the new 32GB module provides approximately 30 percent additional energy savings.

These savings are directly attributable to the adoption of TSV technology, which enables a multi-stacked chip to function at levels comparable to a single silicon chip by shortening signal lines significantly, thereby lowering power consumption and achieving higher density and operational speed.

Samsung has collaborated with CPU and controller designers in addition to some current server system customers to facilitate quicker adoption of 3D-TSV server modules, and to pave the way for more easily supporting 32GB and higher-density memory modules based on 20nm-class DDR3 for use in high-capacity servers.

For more information about Samsung Green DDR3, visit www.samsung.com/GreenMemory