Cooler Master, an industry leading chassis, thermal solution,
peripheral, and accessory manufacturer, signals the rebirth of two
household names in computing, the Hyper 212 EVO and Hyper TX3 EVO CPU
Coolers. They come packed with an improved tower fin design, heat pipe
layout, upgraded fans, and fan brackets. All of which provides an even
more extreme value for end-users of all types.
Improved Cooling Design
The Hyper 212 & TX3 EVO cooling systems are designed and optimized
to provide the best user experience and cooling potential for a new
generation of processors. The Hyper 212 EVO now features four Cooler
Master patented Continuous Direct Contact (CDC) heat pipes that are
tightly packed into a flat array on the CPU Cooler base. This acts as a
virtual vapor chamber that dissipates a large amount of heat. The
aluminum fin structure has been optimized to provide the perfect
performance balance between high and low speed fan operations.
Optimized for current and future generation sockets, the Hyper TX3 EVO
sees improvement in its Direct Contact heat pipe performance, expanded
socket support, and a higher quality 92mm wide-range PWM fan.
Simple Installation / Dual Fan Design
A high performance PWM fan with anti-vibration rubber pads and a set of
quick-snap brackets are included with each CPU cooler. In addition, an
extra set of quick-snap brackets and anti-vibration rubber pads come
standard to give users the option of enabling even greater cooling
performance by installing another fan. The quick-snap brackets make
changing, adding, and cleaning fans an easy task that requires only a
few seconds. Dynamically control the included PWM fan via BIOS or
OS-based motherboard tuning applications. There is no need to choose
between overclocking performance and stock stability, the Hyper 212
& TX3 EVO are a versatile pair that tailor noise and performance to
any need.
Find the new legend, the Hyper 212 & TX3 EVO, at online and retail
locations that sell your favorite Cooler Master, CM Storm, and Choiix
products. They will be available in October 2011.
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